eSilicon’s strategic partnerships with manufacturing and packaging suppliers give you access to the best chip packaging solutions for your application. We can quickly assess your design’s packaging needs and match them with the most appropriate capabilities within our value chain. Our in-house packaging team evaluates your design up front to make early critical determinations in design improvement for performance and then helps you select a package and supplier that are best suited for your specific application. Our expertise in mature and emerging packaging technologies coupled with our tier-one suppliers’ capabilities helps us help you make the right choice for your design.
Concurrent Packaging Design for Better Signal Integrity and Manufacturability
Concurrent design — also known as co-design — is part of our culture at eSilicon. We do not consider packaging as a separate step in the product development process. Instead, packaging is an integral step well before any physical design of silicon begins. Packaging leads the die floorplan and signal location effort, which we believe is critical for accounting for all the downstream compatibility and integration. While this started as a mechanism to ensure better system-level signal integrity, it also helps in system-in-package (SIP) solutions, particularly in 3D integration. The integration of various die in a cost-effective package requires significant upfront planning and we believe this co-design approach is critical.