Engagement Solutions
eSilicon delivers ASICs and ASSPs to OEMs and fabless semiconductor companies (FSCs) through a fast, flexible, lower-risk path to volume production by deploying our comprehensive suite of design through manufacturing services. We serve a wide variety of markets including the communications, computer, consumer and industrial segments.
Engage at the Level That Best Suits Your ASIC Design
The eSilicon® flexible engagement model allows customers to hand off their design to us at RTL level, netlist level, GDSII level or the production level, with eSilicon delivering high-yielding, tested and packaged chips with our customer's logo on them.
eSilicon Engagement Model
Re-Focus on Your Core Business
Whether you need ASICs or ASSPs, custom semiconductor IP to optimize your chip’s performance, or semiconductor manufacturing services to drive your proven chip through volume production, let us manage your design through production so you can focus on R&D for your next innovation.
